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Modified packaging for KODAK FLEXCEL Thermal Imaging Layer (TIL and TIL-R)


May 2021: There has been a modification to the standard packaging for our Thermal Imaging Layer TIL and TIL-R products for the specific catalog numbers listed in the attached notification.

This is because of a short-term shortage in our standard chipboard material which is used as a protective layer for the stacks of film within the polybags.

For a limited period, the chipboard will be substituted with a thin e-flute corrugated sheet. This modified configuration has been tested and the test confirms that the film is held securely. Future batches will revert to the standard configuration once supply resumes.


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